The polishing and thin section laboratory has a wide range of facities for preparation of polished blocks, covered and polished thin sections and polished wafers.
Struers Accutom saw for controlled cutting of small samples.
Logitec trim saw.
Buehler slicing saw.
Buehler
IsoMet 5000 precision low speed saw.
Buehler
Petro-Thin thin sectioning system.
Buehler grinding-polishing machine.
VacuCell cyclical vacuum oven.
Kemet 300 lapping machines.
Logitec LP30 grinder.
Contact
Academic and industrial users should contact Dawn Stewart for information on access and charges.
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